Description
Single TEM Thin Film Standard dispersed onto holey Carbon film supported by a 3.05mm(dia) 400 mesh Copper Grid.
Chosen Material: Olivine
Element | WT% | Compound | WT% |
Fe | 7.75% | FeO | 9.98% |
Si | 17.97% | SiO2 | 38.45% |
Mg | 31.1% | MgO | 51.57% |
O | 43.18% |
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