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Description
EMS one part Epoxy Gold Paste is a gold-filled conductive bonding, exhibiting high electrical conductivity and bond strength. This Gold Paste is used in preference to silver-epoxy or other silver preparations to avoid silver migration problems, or when a higher signal is required.
This Gold Paste is well suited to all SEM work, and it bonds well to alumina ceramic substrate, phenolic circuit boards, and transistor headers. It is also useful in a variety of applications in solid state and hybrid circuits including attachment, bonding semiconductor devices, heat sinks, capacitor chips.
Properties of Epoxy Gold-Paste:
| Composition | 88% Gold |
| System | One-part époxy |
| Viscosity | 175,000 cps |
| Pot Life (25°C) | 6 months |
| Cure | 15 hrs. @ 150°C, or 1 hr. @ 150°C plus 2 hrs. @ 200°C |
| Elec. Resist (Ohm-cm) | 4 x 104 |
| Bond Shear Strength | 1000 psi |
| Outgasing (postcure) | 0.70% 1000 hrs @ 125°C |
| Thinner | Butyl carbitol acetate or butyl cellosolve acetate |
| Serv. Temp. Range | -65°C to +200°C |
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