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Description
Single TEM Thin Film Standard dispersed onto holey Carbon film supported by a 3.05mm(dia) 400 mesh Copper Grid.
Chosen Material: Diopside
| Element | WT% | Compound | WT% |
| Fe | 1.94% | FeO | 2.50% |
| Mg | 10.51% | MgO | 17.42% |
| Ca | 19.09% | CaO | 26.71% |
| Si | 24.95% | SiO2 | 53.37% |
| O | 43.51% |
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