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Description
Epo-Tek® H22 is a two component,
silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.
Maximum Bond Line Cure Schedule:
| 150°C | 5 minutes |
| 120°C | 10 minutes |
| 100°C | 15 minutes |
| 80°C | 45 minutes |
Epo-Tek® H22 features:
– Smooth, free-flowing, slightly thixotropic paste
– High Tg allows it to be used for high temperature applications (≤300°C)
– Contains no solvents – It is a NASA approved low outgasing époxy
– Excellent resistance to solvents, chemicals and moisture
– Extended pot life and fast curing at low temperature <100°C
– Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding
Typical properties: (to be used as a guide only, not a specification)
Physical Properties
| Color: | Part A: silver; Part B: amber |
| Consistency: | Smooth, flowing paste |
| Viscosity (@ 100 RPM / 23°C): | 12,000-20,000 cPs |
| Thixotropic Index: | 2.36 |
| Glass Transition Temp (Tg): | ≥100°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 39 x 10-6 in/in/°C Above Tg: 224 x 10-6 in/in/°C |
| Shore D hardness: | 80 |
| Lap Shear Strength @ 23°C: | 1,980 psi |
| Die Shear Strength @ 23°C: | >5 kg / 1,700 psi |
| Degradation Temp (TGA): | 454°C |
| Weight Loss: | @ 200°C: 0.09% @ 300°C: 1.42% @ 250°C: 0.23% |
| Operating Temp: | Continuous: -55°C to 250°C Intermittent: -55°C to 350°C |
| Storage Modulus @ 23°C: | 540, 120 psi |
| Ion: | Cl- 175 ppm Na+ 60 ppm NH4+ 148 ppm K+ 6 ppm |
| Particle Size: | ≤45 microns |
Electrical Properties:
| Volume Resistivity @ 23°C: | ≤0.0005 Ohm-cm |
Thermal Properties:
| Thermal Conductivity: | 0.94 W/mK |
Storage : RT
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